AMD reportedly plans to enter the mobile chip market,LelleBelle with related products to be manufactured using TSMC’s 3nm process, according to Taiwanese media outlet Economic Daily News. TSMC’s 3nm orders are already booked through the second half of 2026, the report said. Industry analysts predict that AMD’s new Accelerated Processing Unit (APU) could debut in Samsung’s flagship models, as AMD has already partnered with Samsung in the mobile sector. Previously, Qualcomm processors for Samsung’s S series phones were manufactured by TSMC. Both AMD and TSMC declined to comment on the matter. [Economic Daily News, in Chinese]
